BGA Assembly


BGA (Ball Grid Array) Assembly Services with X-ray Inspection

988 is able to provide BGA assembly, BGA rework and BGA Reballing services and have a 6-year experience. With the advanced BGA placement equipment, standard BGA assembly processes and X-ray test equipment, you could get high quality BGA boards from us.

BGA Assembly Capability

988 has rich experience in handling all types of BGAs from micro BGAs (ball pitch 0.3mm) to large size BGAs (ball pitch 0.8mm), and from ceramic BGAs to plastic BGAs. 
BGA Assembly Process/Thermal profiles
Thermal profile is the most importance one in the BGA assembly process. Our SMT engineers will carefully review your PCB files and the BGAs datasheets to make a best thermal profile for your BGA assembly. We will take the BGA size, BGA ball material composition (leaded or lead-free) into consideration to make effective thermal profiles. When the BGA physical size is large, we will optimize the thermal profile to localize the heating on the internal BGA. Or it will cause a void. 988 follows the IPC Class II to control the void under 25% of total solder ball diameter. Lead-free BGA will go through a specialized lead-free thermal profile to avoid open ball problems resulting from the lower temperature. On the other hand, leaded BGA will take a specialized leaded process, to avoid the higher temperatures from causing pin-short.
When we receive your Turn-Key order, we will check your PCB design for BGA combined with DFM (Design for manufacturability) review, including checking the circuit board material, surface finish, maximum warpage requirement and solder mask clearance.  

BGA soldering, BGA Rework & Reballing

You may have only a few BGAs or fine pitch parts on the PCBs  for R&D prototypes. 988 could help -- we are able to  provide a BGA soldering service for testing and evaluation purposes. Additionally, we can support you for BGA rework and BGA reballing with a nice price. We follow five basic steps to carry out BGA rework:
1. Components removal
2. Site preparation
3. Solder paste application
4. BGA replacement
5. Reflow process
You will get a 100% quality assurance for the BGA rework. 

BGA Assembly X-Ray Inspection

988 will use an X-Ray machine to detect various defects which might happen during the BGA assembly. With the help of X-ray inspection, we could eliminate soldering problems on the board.
send your requirement to: